Geophysical Acquistion Systems Borehole Seismic Receiver Array

Borehole Seismic Receiver Array

Miniaturized Multi-component Borehole Sonde String

Slimhole BSR Array: Borehole Seismic Receiver Array Product Brochure

  • 24-Bit x 4-Channel Digitizer in each Shuttle
  • Ultra Low Noise Digitizer enables recording of low amplitude microseismic events, 3D-VSP, Crosswell Seismic Imaging, etc
  • Slim-hole sonde 1.6 inch OD (
  • 3C Sensor Packages available: 3C Tri-axis Orthogonal Geophone
  • OMNI-2400 High-output Geophone Sensors
  • Machined stainless housing Minimizes Mechanical Resonance for High Resolution, High Frequency Recording
    Direct connection sub-arrays, armored Wireline, or Rigid Interconnects available with high-pressure multi-conductor booted connectors
  • Flexible or Rigid Interconnects may be connected “back-to-back” to form longer intervals
  • Maximum Distance between sonde modules is 100 Meters
  • Maximum Temperature Rating 150 oC
  • Maximum Temperature Rating 150 oC
  • Maximum Pressure Rating 20,000 psi
  • Up to 480 3-Component Levels per well deployment
  • Configurations for vertical, deviated and horizontal wellbore deployments
  • Adaptable housing for user defined application specific coupling devices

DDS-250 Downhole Shuttle

Mechanical-clamped Digital Downhole Shuttle

Borehole Sensors DDS-250 Product & Features Brochure

DDS-250 Features:

  • 24-Bit x 4-Channel Digitizer in each Shuttle
  • Ultra Low Noise Digitizer enables recording of ultra low amplitude microseismic events
  • Slim-hole Shuttle 2.50 inch OD (63 mm)
  • 3C or 4C Sensor Packages available: 3C—Tri-axis Orthogonal Geophone and 4C— Tri-axis Orthogonal Geophone and Hydrophone
  • Dual-Element OMNI-2400 High-output Geophone Sensor
  • DEEPENDER 5000 Hydrophone Module for 4-component Recording
  • Solid Machined Titanium Shuttle Body Minimizes Mechanical Resonance for High Resolution, High Frequency Recording
  • Selectable Open-Close Motor Control for each Shuttle with special “POWER BOOST” operator control
  • Armored Wireline or Rigid Interconnects available with high-pressure multi-conductor booted conductors
  • Flexible or Rigid Interconnects may be connected “back-to-back” to form longer intervals
  • Maximum Distance between DDS-250 is 50 Meters
  • Maximum Temperature Rating —150 oC
  • Maximum Pressure Rating — 20,000 psi

Up to THIRTY-TWO (32) 4-Component Levels per well deployment

Specifications are subject to change without notice.

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